СПОСОБ ПАЙКИ АЛЮМИНИЯ И АЛЮМИНИЕВЫХ СПЛАВОВ, КОМПОЗИЦИЯ ДЛЯ ПАЙКИ АЛЮМИНИЯ И АЛЮМИНИЕВЫХ СПЛАВОВ

摘要

FIELD: procedures for soldering aluminum and its alloy without using solder. ^ SUBSTANCE: method is realized with use of composition containing, mass %: alkali metal fluosilicate, 30 -98; aluminum fluoride (AlF3) or its mixture with potassium fluo-aluminate, 1 -14; aluminum powder, 1 -56. It is possible to use composition in content of ready mixture with organic dissolving agents and additional matters. Composition may contain as alkali metal fluosilicate potassium and(or)rubidium fluosilicate and(or) cesium fluosilicate and(or) lithium fluosilicate and(or) their mixtures. ^ EFFECT: possibility for effective reliable soldering of parts of different configuration and thickness. ^ 12 cl, 3 ex