| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer bonding method capable of applying a wax on the entire of the rear surface of a semiconductor wafer uniformly in shape and thickness, and an apparatus thereof. SOLUTION: Immediately before applying a wax to the rear surface of a silicon wafer W in a wax application section 15 of a semiconductor wafer bonding device 10 (S104), a prebaking section 14 prebakes the silicon wafer W to a predetermined temperature (S103) to control the temperature of the silicon wafer W, and consequently, control the temperature (viscosity) of the wax to be applied to the silicon wafer W. In this way, the wax can be applied to the entire rear surface of the silicon wafer W with a uniform shape and a uniform thickness. COPYRIGHT: (C)2006,JPO&NCIPI |
