DIE ATTACHING FILM FITTED WITH DICING-SHEET FUNCTION, SEMICONDUCTOR DEVICE MANUFACTURING METHOD USING SAME, AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a silicon-wafer regeneration method using a highly reliable die attaching film fitted with a dicing-sheet function capable of peeling a film-like bonding agent from the rear surface of a silicon wafer without damaging the wafer, when requiring the reuse of the silicon wafer due to the faultiness generated in the case of sticking, etc. SOLUTION: The silicon-wafer regeneration method includes a process for irradiating with ultraviolet rays a die attaching film fitted with a dicing-sheet function whereon a silicon wafer 5 is stuck, and includes a process for peeling thereafter the silicon wafer 5 from the die attaching film fitted with a dicing-sheet function whereon the silicon wafer 5 is stuck. COPYRIGHT: (C)2006,JPO&NCIPI