发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a printed circuit board ensuring excellent reliability of connection between internal wall of through-hole and through-conductor thereof, and to provide a method of manufacturing the same. SOLUTION: The printed circuit board 21 comprises an insulated base material 5 including at least fiber 1 and resin 3, a through-hole 7 formed to the insulated base material 5, and a through-conductor 9 constituted of the metal phase formed to the through-conductor 7. In this printed circuit board 21, an alienating part A alienating the fiber 1 and resin 3 is opened to the through-hole 7, and a sealing conductor 11 is also formed to the alienating part A. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006237241(A) 申请公布日期 2006.09.07
申请号 JP20050049198 申请日期 2005.02.24
申请人 KYOCERA CORP 发明人 YUGAWA HIDETOSHI
分类号 H05K1/03;H05K3/00;H05K3/42 主分类号 H05K1/03
代理机构 代理人
主权项
地址