发明名称 ASSEMBLED PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide an assembled printed circuit board which can suppress a warp or a distortion generated in the case of reflow heating, etc. SOLUTION: In the assembled printed circuit board having a plurality of individual printed circuit boards connected by supporting sections, the supporting sections are arranged at the three side faces of total four side faces of the two side faces of the longitudinal side direction of the rectangle-like outer frame in the individual printed circuit board, and the two side faces of the short side part direction of the rectangular-like outer frame, and the other one side face except for the above supporting sections of the periphery of the individual printed circuit board is a drawing part. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006237099(A) 申请公布日期 2006.09.07
申请号 JP20050046439 申请日期 2005.02.23
申请人 CMK CORP 发明人 TOTSUKA SHUICHI;IKEDA NAOTAKA
分类号 H05K1/02 主分类号 H05K1/02
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