| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to position either an opaque wafer and a transparent wafer. SOLUTION: The controller 80 of a wafer alignment apparatus 40 includes a measuring section 81 which measures a transmission sensor photodetection amount, a measuring section 82 which measures a reflection type sensor photodetection amount, a comparator 83 which compares the transmission sensor photodetection amount and the reflection type sensor photodetection amount, a judgment section 84 which judges that is the transparent wafer when there are more transmission sensor photodetection amounts, a judgment section 85 which judges that is the opaque wafer when there are more reflecting type sensor photodetection amounts, a transparent wafer notch detector 86 which is connected to the judgment section 84 and detects the position of the notch of the transparent wafer by the transmission sensor photodetection amount and an angle signal from a motor 47, an opaque wafer notch detection unit 87 which is connected to the judgment section 85 and detects the position of the notch of the opaque wafer by the reflecting type sensor photodetection amount and an angle signal from the motor 47, and a wafer alignment unit 88 which arranges the position of the notch of fiver wafers. COPYRIGHT: (C)2006,JPO&NCIPI |
