发明名称 PROCESS FOR PRODUCING WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent pattern shift of the ceramic dielectric layer of a plurality of first laminates and a conductor layer being laid in contact therewith and the dielectric layer of polymer material in a second laminate effectively. <P>SOLUTION: In a sticking process, a positioning pin 90 is inserted into guide through holes 50h, 70h formed in a plurality of first laminates 60 and second laminates 70, respectively, and the plurality of first laminates 60 are contained in a plurality of containing portions 83w bored in a spacer 83 thus sticking the plurality of first laminates 60 and second laminates 70 while positioning each other. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2006237115(A) 申请公布日期 2006.09.07
申请号 JP20050046733 申请日期 2005.02.23
申请人 NGK SPARK PLUG CO LTD 发明人 YURI SHINJI;ORIGUCHI MAKOTO
分类号 H05K3/46 主分类号 H05K3/46
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