发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To obtain a heat sink capable of improving heat dissipation ability and uniformly cooling an electronic machine placed in the heat sink. SOLUTION: The heat sink includes a base plate 3, a pair of opposite side plates 4 provided perpendicularly to the base plate 3, a plurality of platelike fins 5 provided on the base plate 3 in parallel with the side plates 4 between the pair of side plates 4, an upper plate 6 provided on the side plate 4 opposite to the base plate 3, an axial fan 7 having a diameter smaller than a distance between the fins 5 provided at both ends and placed in contact with the upper plate 6 between the base plate 3 and the upper plate 6, and a ventilation flue passing under the axial fan 7 for connecting from one of side plates 4 to the other side plate 4. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006237366(A) 申请公布日期 2006.09.07
申请号 JP20050051259 申请日期 2005.02.25
申请人 MITSUBISHI ELECTRIC CORP 发明人 OGUSHI TETSURO;KICHISE KOJI;ISHIKAWA HIROAKI;TANAKA TOSHITAKA
分类号 H05K7/20;H01L23/36 主分类号 H05K7/20
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