| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a heating/cooling device having improved heat resistance and durability for absorbing external stress such as load, tension, impact or distortion on the heating/cooling device and reducing load on a thermoelectric module without complicated hardening processes such as UV irradiation and heating. SOLUTION: The heating/cooling device comprises the thermoelectric module 3 held between a first heat exchange block 1 and a second heat exchange block 2. A resin frame 16 is joined to the thermoelectric module 3 to be encircled. A joint portion between the edge of the resin frame 16 and at least the second heat exchange block 2 is sealed with two-liquid reactive low temperature hardening adhesive 17. The method is provided for manufacturing the device. COPYRIGHT: (C)2006,JPO&NCIPI
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