| 摘要 |
PROBLEM TO BE SOLVED: To provide a sealing liquid epoxy resin composition excellent in fluidity, having good workability, capable of achieving high reliability of sealing, by minimizing warpage of a sealed article after cured, and capable of reducing an amount of the warpage caused by a heat history in case of a reflow. SOLUTION: The resin composition contains an epoxy resin, a curing agent, and a filler as essential components, is used as a sealing agent by being heated and cured, after coated on a surface of an electronic component or a member constituting a semiconductor device, and exists as a liquid at room temperature. Further, the cured product thereof has a glass transition temperature of lower than 40°C and a coefficient of linear expansion of not less than 5 ppm/°C and less than 15 ppm/°C at a temperature lower than the glass transition temperature. COPYRIGHT: (C)2006,JPO&NCIPI
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