发明名称 Resin moldings and conductive resin composition
摘要 A shaped resin article comprising a polyamide (A) (comprising at least two different polyamide components), a polyphenylene ether (B) and a partially hydrogenated block copolymer (C) (obtained by partially hydrogenating a block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block) including a block copolymer (C-1) having a number average molecular weight of from 200,000 to 300,000, wherein (A) is present as a continuous phase in which (B) is dispersed to form a dispersed phase, and (C) is present in the continuous phase of (A) and/or the dispersed phase of (B), wherein the surface area of the polyamide (A) exposed on the overall surface of the shaped resin article is at least 80%, based on the surface area of the shaped resin article. A conductive resin composition comprising a polyamide (A), a polyphenylene ether (B), a partially hydrogenated block copolymer (C) comprising an aromatic vinyl polymer block and a conjugated diene polymer block, a conductive carbonaceous material (D) and wollastonite particles (E).
申请公布号 US2006199903(A1) 申请公布日期 2006.09.07
申请号 US20050553209 申请日期 2005.10.13
申请人 MIYOSHI TAKAAKI;NODA KAZUYA;HORIO MITSUHIRO;YOSHINAGA YUUJI 发明人 MIYOSHI TAKAAKI;NODA KAZUYA;HORIO MITSUHIRO;YOSHINAGA YUUJI
分类号 C08L53/00;C08L53/02;C08L71/12;C08L77/00;C08L77/02;C08L77/06 主分类号 C08L53/00
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