| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein an alignment dislocation during joining of semiconductor chips is prevented, and stable connection is established, and also to provide its manufacturing method. SOLUTION: The method for manufacturing a semiconductor device 10 includes steps of: forming an insulating layer 3 on a semiconductor substrate 2 having a pad electrode 1; manufacturing a first semiconductor chip 6 through a step of selectively removing the insulating layer 3 on the pad electrode 1, exposing the pad electrode 1 in the insulating layer 3, and forming a recess 5; inserting the pump electrode 8 of the second semiconductor chip 9 into the recess 5 of the first semiconductor chip 6; and connecting the bump electrode 8 with the pad electrode 1 to join the first and second semiconductor chips 6 and 9. The semiconductor device 10 is obtained through this manufacturing method. COPYRIGHT: (C)2006,JPO&NCIPI |
