发明名称 |
SEMICONDUCTOR DEVICE, ELECTRONIC APPARATUS, AND PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which is manufactured by simplifying the manufacturing process while enhancing utilization efficiency of material, and also to provide a display, its manufacturing technology, and a technique for forming the wiring pattern constituting these semiconductor devices and the display with desired profile and high controllability. SOLUTION: Conductor layers having nodes are formed adjacently at a uniform interval. In the adjacent conductive layers, a liquid drop is ejected while shifting the central position in the length direction of wiring not to be aligned in the line width direction. Since the center of a liquid drop is shifted, maximum line width parts (maximum node) of the conductive layers do not adjoin and the conductive layers can be provided adjacently at a narrower interval. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006237586(A) |
申请公布日期 |
2006.09.07 |
申请号 |
JP20060017033 |
申请日期 |
2006.01.26 |
申请人 |
SEMICONDUCTOR ENERGY LAB CO LTD |
发明人 |
ISA TOSHIYUKI;FUJII ITSUKI;MORISUE MASAFUMI;KAWAMATA IKUKO |
分类号 |
H01L21/3205;B05D1/26;B05D7/00;H01L21/288;H01L21/336;H01L29/417;H01L29/423;H01L29/49;H01L29/786 |
主分类号 |
H01L21/3205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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