发明名称 Honeycomb structure
摘要 There is disclosed a honeycomb structure in which a crack due to a thermal shock is not easily generated and in which a crack is not easily developed entirely even if the crack is generated. A honeycomb structure 100 includes: partition walls 1 formed so as to define a plurality of cells 8 whose section perpendicular to an axial direction is quadrangular and which extend in an axial direction; and an outer peripheral wall 2 which surrounds the partition walls 1 , and an average value (Ts) of outer peripheral wall thicknesses is Tp<Ts<=10xTp (Tp: average value of partition wall thicknesses), and the outer peripheral wall thickness in a specific position is set to be smaller than that in another position. An average value (Tp) of partition wall thicknesses is preferably 0.038 mm<=Tp<=0.43 mm.
申请公布号 US2006198984(A1) 申请公布日期 2006.09.07
申请号 US20060360698 申请日期 2006.02.24
申请人 NGK INSULATORS, LTD. 发明人 AOKI TAKASHI
分类号 B32B3/12 主分类号 B32B3/12
代理机构 代理人
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