| 摘要 |
<P>PROBLEM TO BE SOLVED: To obtain excellent heat dissipation performance by allowing a heat sink placed on an electronic component such as an LSI to be deformed so as to imitate the shape of the electronic component. <P>SOLUTION: The heat sink 1 has a structure capable of being easily bent along a line dividing the bottom surface into a plurality of partial regions. The heat sink 1 is placed on an LSI 4 via a thermally conductive grease 3, and is fixed by heat sink fixing pins 2 so that the heat sink 1 may be pressed on the LSI 4 in a portion near the center where the partial portions of the heat sink 1 overlaps the LSI 4. Thus, the heat sink 1 is deformed so as to imitate the shape of the contacting electronic component, and an average distance between the LSI 4 and the heat sink 1 is reduced, and the thermal resistance can be reduced. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
