| 摘要 |
<P>PROBLEM TO BE SOLVED: To form a stable hollow structure. <P>SOLUTION: A semiconductor device 1 in which a semiconductor chip 3 is flip-chip mounted on a substrate 2, comprises: a plate member 4 which is bonded to the opposite surface of the flip-chip mounted surface of the semiconductor chip 3 and protrudes outside the side end face of the semiconductor chip 3; and a resin sheet 5 which covers from the opposite surface of the plate member 4 from the bonded semiconductor chip 3, flows from the corners of the plate member 4 to the substrate 2 without making contact with the semiconductor chip 3, and has edges bonded to the substrate 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
