发明名称 COMPONENT MOUNTING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a component mounting method which improves productivity and stability of quality of a substrate with components mounted thereon. <P>SOLUTION: The component mounting method comprises: a suction step S102 wherein a head 112 sucks a plurality of components; imaging step S104 wherein the plurality of components sucked by the head 112 are imaged; detection step S106 wherein the states of the components sucked by the head 112 are detected from the imaging results of the imaging step S104; mounting order determining step S110 wherein the order in which the components are to be mounted based on the detected states of the components is determined; and mounting step S112 wherein the head 112 is instructed to mount the components on the substrate 20 in the determined mounting order. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006237174(A) 申请公布日期 2006.09.07
申请号 JP20050048022 申请日期 2005.02.23
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KURIBAYASHI TAKESHI;MAENISHI YASUHIRO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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