| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method capable of keeping a good process performance and performing stable plasma process. SOLUTION: The plasma process is executed to processed substrates 10 for every substrates, in a step of finishing the plasma process to the processed substrates 10 for every (n) substrates (n=1, 2, 3, ...), after the processed substrates 10 after the plasma process was completed, are carried out of a plasma process chamber 1, after plasma cleaning is executed within the plasma process chamber 1, without applying high frequency voltage to a sample holder 8 with no processed substrate 10 existing on the sample holder 8, the plasma process is executed to the processed substrates 10 for (n) substrates. COPYRIGHT: (C)2006,JPO&NCIPI
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