| 摘要 |
PROBLEM TO BE SOLVED: To provide a small light emitting element module 100 composed of a light emitting element 1, and a drive IC 6 mounted inside a package 7 which has a configuration wherein a space in which a Peltier cooler is housed can be ensured and heat released from the drive IC 6 can be dissipated through the back of the package 7 without exerting an influence on the light emitting element 1. SOLUTION: A grounded coplanar transmission line board 5 is arranged between a metal block 9 mounted with the light emitting element 1 and the drive IC 6. The metal block 9 and the board 5 are arranged on the Peltier cooler 8, and the drive IC 6 is mounted on a metallic stand 7b. The drive IC 6 is arranged below an optical axis, and the electrode of the Peltier cooler is arranged above the opposed optical axis. COPYRIGHT: (C)2006,JPO&NCIPI
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