发明名称 Layered CU-based electrode for high-dielectric constant oxide thin film-based devices
摘要 A layered device including a substrate; an adhering layer thereon. An electrical conducting layer such as copper is deposited on the adhering layer and then a barrier layer of an amorphous oxide of TiAl followed by a high dielectric layer are deposited to form one or more of an electrical device such as a capacitor or a transistor or MEMS and/or a magnetic device.
申请公布号 US2006199740(A1) 申请公布日期 2006.09.07
申请号 US20050073263 申请日期 2005.03.03
申请人 发明人 AUCIELLO ORLANDO
分类号 H01L39/14 主分类号 H01L39/14
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