发明名称 |
Kontaktlose Chipkarte und Herstellungsverfahren |
摘要 |
In a non-contact IC card comprising a substrate and provided thereon at least an IC chip and an antenna coil formed by etching, a connecting terminal of the antenna coil and a connecting bump of the IC chip are interconnected in a face-down fashion via an anisotropic conductive adhesive layer, or interconnected by wire bonding. <IMAGE> |
申请公布号 |
DE69635724(T2) |
申请公布日期 |
2006.09.07 |
申请号 |
DE1996635724T |
申请日期 |
1996.04.11 |
申请人 |
SONY CHEMICALS CORP. |
发明人 |
ORIHARA, KATSUHISA;FUJIMOTO, MASAHIRO;MONKAWA, HARUO;KURITA, HIDEYUKI |
分类号 |
B42D15/10;G06K19/077;G06K19/07 |
主分类号 |
B42D15/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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