发明名称 |
X-ray inspection device and x-ray inspection method |
摘要 |
A X-ray inspection device for inspecting a solder connection portion between a circuit device having a solder ball and a printed circuit board having a land includes: X-ray irradiating means for irradiating X-ray to the solder connection portion between the solder ball and the land; X-ray detecting means for detecting the X-ray transmitted through the solder connection portion and for outputting a detection signal; and image forming means for forming and outputting a horizontal tomographic image of the solder connection portion on the basis of the detection signal. The horizontal tomographic image shows existence or nonexistence of a solder bump disposed on a side of the land.
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申请公布号 |
US2006196914(A1) |
申请公布日期 |
2006.09.07 |
申请号 |
US20060357045 |
申请日期 |
2006.02.21 |
申请人 |
DENSO CORPORATION |
发明人 |
HIRAMATSU TOMOYUKI;HAYASHI YOSHINORI;HASEGAWA HISASHI |
分类号 |
B23K31/12;G01B7/00 |
主分类号 |
B23K31/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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