PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, RESIST PATTERN FORMING METHOD, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR REMOVING PHOTOSET OBJECT

摘要

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of well improving removability while maintaining excellent resolution (particularly ≤20 μm).

SOLUTION: The photosensitive resin composition contains a photopolymerizable compound having two or more ethylenically unsaturated bonds within a molecule and a photopolymerization initiator, wherein a characteristic group represented by formula (1) (where R1denotes alkyl and R2denotes H or alkyl) and having a bond which is broken when heated at 130-250°C is further included within the molecule of the photopolymerizable compound.

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