发明名称 METHOD FOR GENERATING MASK PATTERN DATA/MASK INSPECTION DATA, AND METHOD FOR MANUFACTURING/INSPECTING PHOTOMASK
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for manufacturing/inspecting a photomask by which the defect detection sensitivity can be enhanced. <P>SOLUTION: The method includes steps of: preparing design data of a semiconductor device; preparing lithography conditions relating to the lithography process for transferring a mask pattern formed in a photomask onto a wafer and wafer process conditions relating to processing the wafer using the pattern transferred onto the wafer; preparing a first proximity correction rule or a first proximity correction model to correct the proximity effect relating to the lithography conditions and the wafer process conditions; creating mask pattern data based on the design data and the first proximity correction rule or the first proximity correction model; and creating mask inspection data corresponding to the mask pattern data. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006235327(A) 申请公布日期 2006.09.07
申请号 JP20050050992 申请日期 2005.02.25
申请人 TOSHIBA CORP 发明人 KAMO TAKASHI;IKENAGA OSAMU;TSUTSUI TOMOHIRO
分类号 G03F1/36;G03F1/68;H01L21/027 主分类号 G03F1/36
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