发明名称 INSULATING FILM FORMING METHOD EMPLOYING LIQUID DROP DISCHARGING SYSTEM, METHOD OF MANUFACTURING SURFACE ACOUSTIC WAVE ELEMENT PIECE, SURFACE ACOUSTIC WAVE ELEMENT, AND SURFACE ACOUSTIC WAVE DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an insulating film forming method employing a liquid drop discharging system appropriate for manufacturing a surface acoustic wave element piece. SOLUTION: In an insulating film forming method employing a liquid drop discharging system for forming an insulating film covering a pattern electrode of a uniform film thickness formed on a piezoelectric substrate, liquid drops of insulating film forming materials whose discharge amounts are controlled are selectively applied to an insulating film forming portion of metal wiring formed on the piezoelectric substrate by the liquid drop discharging system and to the piezoelectric substrate, and the insulating film forming portion and a non-forming portion are formed on the metal wiring. The insulating film forming materials use inorganic materials. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006238327(A) 申请公布日期 2006.09.07
申请号 JP20050053360 申请日期 2005.02.28
申请人 SEIKO EPSON CORP 发明人 YOSHIZAWA GEN
分类号 H03H3/08;B05D1/26;B05D5/12;H03H9/145 主分类号 H03H3/08
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