| 摘要 |
PROBLEM TO BE SOLVED: To correctly position a circuit substrate with respect to a metal mask under a simple and low-cost structure. SOLUTION: First, a rectangular positioning land 3 is formed on the circuit substrate 1 and a rectangular opening part 12 for positioning is formed in the metal mask 7. Besides, the positioning land 3 and the opening part 12 are of an equal length in the long side direction and the opening part 12 is narrow in the short side direction. Consequently, when a cream solder 16 is test-printed, exposed surplus parts 17 where the cream solder 16 is not formed, are formed on the positioning land 3, and the position of the metal mask 10 to the circuit substrate 1 is corrected so that the surplus parts 17 formed above and below the cream solder 16 may be of an equal width, keeping a constant interval between them. Thus the slip-angleθbetween the circuit substrate 1 and the metal mask 10 and the positional deviation between the X direction/Y direction of the circuit substrate 1 can be corrected. COPYRIGHT: (C)2006,JPO&NCIPI
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