发明名称 |
Etching solution, method of etching and printed wiring board |
摘要 |
There is provided an etching solution comprised of a cupric chloride solution and a high-concentration triazole type compound added to the cupric chloride solution and capable of forming an etching-inhibiting coating. In a process of forming a circuit pattern by etching with the etching solution, an etching-inhibiting coating is selected formed on parts of a copper foil laid under the edge of an etching resist to effectively inhibit horizontal side-etching of the copper foil from the edge of the etching resist. Also, nonuniform irregularities formed on the side wall of the circuit pattern by the etching improves the adhesion between the circuit pattern and an insulating resin layer covering the circuit pattern.
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申请公布号 |
US2006199394(A1) |
申请公布日期 |
2006.09.07 |
申请号 |
US20050560421 |
申请日期 |
2005.12.14 |
申请人 |
TAKAHASHI TSUNEHISA;SAWA SHIGEKI;MATSUI KAZUHIKO |
发明人 |
TAKAHASHI TSUNEHISA;SAWA SHIGEKI;MATSUI KAZUHIKO |
分类号 |
C23F1/00;C09K13/00;C23F1/02;C23F1/18;C23F1/34;H01L21/302;H01L21/3213;H05K3/06;H05K3/38 |
主分类号 |
C23F1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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