| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed wiring board and a method of manufacturing the same, where odd number of conductive layers are efficiently laminated, the occurrence of curvature will not occur, peeling between each layer is suppressed, and via holes for conduction can be formed at accurate positions. <P>SOLUTION: An odd number n of conductive layers 11-13 and insulating layers 21-23 are laminated alternately. The first conductive layer 11 is a component connection layer. The n-th conductive layer 13 is an external connection layer, to which external connection terminals 7 are bonded. The second to (n-1)-th conductive layers 12 are current transfer layers for transferring internal currents. The surface of the n-th conductive layer 13 is coated with the outermost n-th insulating layer 23, while the external connection terminals 7 are exposed. Bonding holes 3 for bonding external connection terminals 7, that are connected to the n-th conductive layers 11-13, are formed in the n-th insulating layer by laser beam irradiation. A plated metal film 5 is formed in the via holes 31, 32 for conduction. The external connection terminals 7 (solder balls) are bonded to the plated metal film that is exposed through the bonding holes 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
