| 摘要 |
PROBLEM TO BE SOLVED: To provide an efficient method for extracting a sample from a substrate. SOLUTION: A beam such as a focused ion beam is used to form a groove around the sample by slitting two or more times so as to overlap, and subsequently, the lower side of the sample, is cut to separate the sample. Since the sidewall of the slit is not vertical, an overlapping slit enters an inclined sidewall formed by the preceding slit. Because of the large angle of incidence, a cutting speed is remarkably improved, so that the time required for generating a wide groove by performing slitting two or more times so as to overlap, can be reduced more than that required for performing a single deep slit along the periphery of the sample. COPYRIGHT: (C)2006,JPO&NCIPI |
