发明名称 |
Die structure of package and method of manufacturing the same |
摘要 |
A die structure of a package is provided. The die structure of the package includes a carrier and a die. The die includes a first portion and a second portion. The top surface of the first portion is an active surface. The second portion is configured below the first portion. A first width of the first portion is smaller than a second width of the second portion. And the second portion of the die is adhered to the carrier.
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申请公布号 |
US2006197203(A1) |
申请公布日期 |
2006.09.07 |
申请号 |
US20050320635 |
申请日期 |
2005.12.30 |
申请人 |
ADVANCED SEMICONDUCTOR ENGINEERING, INC. |
发明人 |
CHU CHING-SUNG;TSAI TSUNG-TA;HUANG MING-YU |
分类号 |
H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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