| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide polishing device and method for mitigating a drying environment around a wafer carrier. <P>SOLUTION: This polishing device polishes a wafer held by the wafer carrier by making the wafer abut on a rotating polishing pad, while supplying slurry. The polishing device is provided with a humidifying means 70 for controlling the internal humidity to a prescribed value. The polishing is performed, while maintaining the inside of the polishing device at the prescribed humidity. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
