发明名称 |
METHOD FOR MAKING MASK PATTERN, METHOD FOR MAKING LAYOUT, METHOD FOR MANUFACTURING PHOTOMASK, PHOTOMASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To prevent pattern collapse of a line end portion or a defect pattern as a whole and to improve the process margin in lithography and the manufacturing yield of a device. <P>SOLUTION: The method for making a mask pattern comprises: recognizing a dummy pattern 51 which does not effect on device operation among design data of a semiconductor device corresponding to a pattern to be formed in a mask, extracting an end portion of the line or space constituting the recognized dummy pattern 51; and newly arranging a common dummy pattern 52 to connect the extracted end portion and a dummy pattern 51 adjacent to the end portion. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2006235080(A) |
申请公布日期 |
2006.09.07 |
申请号 |
JP20050047461 |
申请日期 |
2005.02.23 |
申请人 |
TOSHIBA CORP |
发明人 |
NAKANO AYAKO;KOTANI TOSHIYA |
分类号 |
G03F1/36;G03F1/68;G03F1/70;G03F7/20;H01L21/027 |
主分类号 |
G03F1/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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