发明名称 METHOD FOR MAKING MASK PATTERN, METHOD FOR MAKING LAYOUT, METHOD FOR MANUFACTURING PHOTOMASK, PHOTOMASK, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To prevent pattern collapse of a line end portion or a defect pattern as a whole and to improve the process margin in lithography and the manufacturing yield of a device. <P>SOLUTION: The method for making a mask pattern comprises: recognizing a dummy pattern 51 which does not effect on device operation among design data of a semiconductor device corresponding to a pattern to be formed in a mask, extracting an end portion of the line or space constituting the recognized dummy pattern 51; and newly arranging a common dummy pattern 52 to connect the extracted end portion and a dummy pattern 51 adjacent to the end portion. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006235080(A) 申请公布日期 2006.09.07
申请号 JP20050047461 申请日期 2005.02.23
申请人 TOSHIBA CORP 发明人 NAKANO AYAKO;KOTANI TOSHIYA
分类号 G03F1/36;G03F1/68;G03F1/70;G03F7/20;H01L21/027 主分类号 G03F1/36
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