发明名称 HEAT RADIATION STRUCTURE OF INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE COMPRISING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a heat radiation structure of an integrated circuit chip and a display device comprising it. SOLUTION: The heat radiation structure of an integrated circuit chip comprises at least one circuit board packaged with at least one integrated circuit chip for driving a panel that reproduces an image, and a heatsink provided with a base bottom part arranges on the rear surface of the integrated circuit chip to adjoin it and a plurality of heat radiation plates tilted from the base bottom part at an angle except for right angle from a virtual surface extending horizontally. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006237558(A) 申请公布日期 2006.09.07
申请号 JP20050324693 申请日期 2005.11.09
申请人 SAMSUNG SDI CO LTD 发明人 JEONG KWANG-JIN
分类号 H01L23/36;G09F9/00;H05K7/20 主分类号 H01L23/36
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