| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which improves the flatness of a metallized conductor and reduce the possibility of peeling of the metallize conductor from an insulating substrate, and which has superior connection reliability and low electric resistance. SOLUTION: The wiring board is provided with: an insulating substrate 1 formed of a glass ceramic sintered body; and a metallized conductor 2 which is formed inside the insulating substrate 1, of which a part is exposed over the surface of the insulating substrate 1, and which contains copper or metallic particulate made mainly of copper. The exposed part of the metallize conductor 2 is electrically connected with an external electric circuit by means of a low-melting-point brazing material. In the metallized conductor, at least the exposed part and the metallic particulate thereunder are spherical, and the average particle size of the metallic particulate is set at 2 to 9μm. COPYRIGHT: (C)2006,JPO&NCIPI |
