| 发明名称 |
STRUCTURE USING SOLDERING |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a structure composed of a substrate and an electrode firmly joined with the substrate. <P>SOLUTION: The structure has the substrate and the electrode 3 joined with the substrate by a soldering. The electrode 3 has a cavity 9 opened to the joint surface of the substrate and the electrode 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
| 申请公布号 |
JP2006237507(A) |
申请公布日期 |
2006.09.07 |
| 申请号 |
JP20050053619 |
申请日期 |
2005.02.28 |
| 申请人 |
MITSUBISHI HEAVY IND LTD |
发明人 |
OKAZAKI SUMIOMI;YAMAZAKI HIROYUKI |
| 分类号 |
H05K1/18;H01R4/34;H01R43/02;H05K1/14;H05K3/32;H05K3/34;H05K3/36;H05K7/06;H05K7/14 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
