| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for supplying a polishing liquid extracting and supplying a polishing liquid having a more uniform concentration without contaminating the polishing liquid, when the polishing liquid in a polishing-liquid supply line is extracted from a vessel in the method for supplying the polishing liquid to the polishing-liquid supply line to a polishing process for a semiconductor wafer. <P>SOLUTION: The method for supplying the polishing liquid supplies the polishing-liquid supply line (1) with the polishing liquid mainly composed of pure water and abrasive grains. In the method, the vessel (2) is arranged to a part of the polishing-liquid supply line (1), and a bellows pump (4) is interposed to a flow path (33) between a suction pipe (31) and a discharge pipe (32) inserted to the vessel to the vessel (2) when the polishing liquid is extracted from the vessel (2) by the suction of the pump. In the method, a circulation system (3) is mounted in which a jet pump (5) is annexed at the front end of the suction pipe (31), and the polishing liquid in the vessel (2) is agitated by the jet pump (5) while circulating the polishing liquid by the circulation system (3). <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
