发明名称 |
DEVICE AND METHOD FOR REMOVING AND CUTTING METAL STRUCTURE |
摘要 |
PROBLEM TO BE SOLVED: To remove and cut a metal structure having radioactivity at high processing speed. SOLUTION: The removing/cutting device of the metal structure comprises a pool 40 for processing reserving electrolytic solution 2; a gripping mechanism 9 that is disposed in the pool 40 for processing and supports the metal structure 8 having radioactivity; a device body 1 to be installed on the supported metal structure 8; a processing electrode 3 arranged on a processing face of the metal structure 8; an electrolytic solution nozzle 21 that is disposed near this processing electrode 3 and applies the electrolytic solution 2; a power supply 4 for supplying current for making the metal structure 8 as the positive electrode and the processing electrode 3 as the negative electrode electrochemically react with each other in the electrolytic solution 2; and a driving mechanism (for example, feeding mechanism 10a) that is disposed between the device body 1 and the processing electrode 3 and drives the processing electrode 3 according to the progress of the electrochemical reaction. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2006234726(A) |
申请公布日期 |
2006.09.07 |
申请号 |
JP20050052853 |
申请日期 |
2005.02.28 |
申请人 |
TOSHIBA CORP |
发明人 |
UEHARA TAKUYA;MUKAI SHIGEHIKO;SENDA ITARU;HAMAMOTO YOSHIO;YAMAMOTO TETSUO |
分类号 |
G21F9/30;G21C19/02;G21F9/28 |
主分类号 |
G21F9/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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