| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid ejection head with a structure which enables a nozzle hole to be formed on a nozzle plate by electro-discharge machining without damage to a liquid-repellent film formed on the nozzle plate. SOLUTION: In the nozzle plate 70 where a plurality of nozzle holes 51 for ejecting a droplet are formed, the conductive liquid-repellent film 71 is formed on one side of a base material 700, composed of a metal, in such a manner that conductivities are made different from each other in the thickness direction of the liquid-repellent film 71 so that the conductivity of a part near the base material 700 can be larger than that of a part near an ejection surface on the other side. In the liquid-repellent film 71, for example, many conductive particulates are distributed by making the densities or sizes of the conductive particulates different from one another in the thickness direction of the liquid-repellent film 71. The nozzle holes 51 are formed by electro-discharge machining from the side opposite to the side, where the liquid-repellent film 71 is formed, of the nozzle plate 70. COPYRIGHT: (C)2006,JPO&NCIPI
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