发明名称 POLYACETAL RESIN COMPOSITION AND MOLDED PRODUCT COMPRISING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a polyacetal resin composition excellent in weatherability and heat stability, suppressing amount of formaldehyde generation and reduced in mold contamination. SOLUTION: The polyacetal resin composition comprises 100 pts.wt. (A) polyacetal resin, 0.01-5 pts.wt. hindered amine-based optical stabilizer expressed by general formula (1), 0.01-5 pts.wt. (C) UV absorber and 0.01-5 pts.wt. (D) hydrazide compound. (In the formula, X expresses an organic group bonding with N through C at the bonded position; Y expresses H or an organic group bonding to 4-position of the piperidyl group through O or N). COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006232937(A) 申请公布日期 2006.09.07
申请号 JP20050047691 申请日期 2005.02.23
申请人 MITSUBISHI ENGINEERING PLASTICS CORP 发明人 FUJIMOTO KUNIHIKO;HIRAI YASUHIRO;SANADA DAISUKE
分类号 C08L59/00;C08K5/24;C08K5/3435;C08K5/3475 主分类号 C08L59/00
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