| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for machining the surface of a workpiece to a flat surface having a desired unevenness distribution generally or correctively by keeping a pressing force of a tool to the machined surface constant, in lapping machining, polishing machining, or grinding machining or the like of the surface of the workpiece such as a semiconductor wafer with the tool having a smaller size of the surface size of the workpiece, and to provide a determination method for a control parameter during the machining. <P>SOLUTION: In the machining method for the surface of the workpiece, the surface is relatively moved to a first direction and a second direction by press-contacting the small diameter tool having a smaller diameter rotating slidably rubbing surface than the surface size to the surface of the workpiece. The surface of the workpiece is machined to the desired shape by changing the traveling speed of the small diameter tool in the first direction corresponding to the distance of the first direction from the workpiece origin to the small diameter tool. The machining amount per unit of time of each position when stopping the tool at a plurality of tool positions on the machining surface is calculated or measured, and the tool stopping time or the speed at each tool position is determined so that the total amount becomes the desired machining amount. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
