| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical pickup for efficiently discharging heat in a semiconductor laser device configured of resin mold. <P>SOLUTION: A laser element mounting part 7 of a frame substrate 2 is provided with flexible wiring 5 electrically and externally connected to a laser element 4, and a resin frame 1 is formed in the frame substrate 2 so that the flexible wiring 5 can be covered. A through-hole 31 put through from the laser element mounting face 7 to a back face 36 is formed in the frame substrate 2, and the through-hole 31 is packed with resin mold. The resin mold packed in the through-hole 31 is formed so as not to be projected from the back face of the frame substrate 2. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
