| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor devices with a high reliablility for connectivity that prevents voids and connection errors and an adhesive to be used for the purpose in alloy formation and junction through thermal eutectic crystal of a metal projection on a semiconductor device electronic pad and a wiring pattern on a circuit board. <P>SOLUTION: This semiconductor device manufacturing method has an epoxy resin adhesive 6, containing fine fillers interposed between a semiconductor device 1 with a metal projection 3 on an electrode pad 2 and a circuit board 4 with a wiring pattern 5, corresponding to the electrode pad. After positioning the metal projection on the semiconductor device and the wiring pattern on the circuit board, this method electrically connects the metal project and circuit board through eutectic alloy formation, by subjecting to heating and pressurization 7 and hardens 6' the adhesive to fix the semiconductor device and circuit board. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
