| 摘要 |
PROBLEM TO BE SOLVED: To provide a process for preventing deterioration of the outer shape of a wafer, specifically, an edge roll-off by eliminating a scratch or an indentation on the end surface portion of a chamfering portion of the semiconductor wafer while preventing an increase in capital investment or in the number of processes as much as possible, and by suppressing over-polishing due to entering of a polishing pad into the main surface of the wafer in a specular chamferring process for specularly polishing the chamferring portion of the wafer. SOLUTION: A method of manufacturing a semiconductor wafer includes a double-sided polishing process for specularly polishing the front and rear surfaces of the semiconductor wafer, and a specularly chamfering process of specularly polishing the chamfering portion of the semiconductor wafer subjected to double-sided polishing. In this method, after a resin-made protective film for suppressing polishing is formed on the front surface or on both the front and rear surfaces of the semiconductor wafer after the double-sided polishing process, and then, the specular chamfering process is performed, and subsequently, the resin-made protective film is eliminated. COPYRIGHT: (C)2006,JPO&NCIPI
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