发明名称 Integrated circuit coolant microchannel with compliant cover
摘要 An apparatus includes a microchannel structure having microchannels formed therein. The microchannels are to transport a coolant and to be proximate to an integrated circuit to transfer heat from the integrated circuit to the coolant. The apparatus also includes a cover positioned on the microchannel structure to define a respective upper wall of each of the microchannels. The cover presents a compliant surface to the microchannels.
申请公布号 US2006196646(A1) 申请公布日期 2006.09.07
申请号 US20050069540 申请日期 2005.03.01
申请人 MYERS ALAN M;CHANG JE-YOUNG;PRASHER RAVI;SAUCIUC IOAN;CHRYSLER GREGORY M;BOYD PATRICK D;CHIU CHIA-PIN 发明人 MYERS ALAN M.;CHANG JE-YOUNG;PRASHER RAVI;SAUCIUC IOAN;CHRYSLER GREGORY M.;BOYD PATRICK D.;CHIU CHIA-PIN
分类号 F28F19/00 主分类号 F28F19/00
代理机构 代理人
主权项
地址