发明名称 |
Methods and apparatuses for electrochemical deposition |
摘要 |
Methods and apparatuses for electrochemically depositing a metal layer onto a substrate. An electrochemical deposition apparatus comprises a substrate holder assembly including a substrate chuck and a relatively soft cathode contact ring. The cathode contact ring comprises an inner portion and an outer portion, wherein the inner portion directly contacts the substrate. An anode is disposed in an electrolyte container. A power supply connects the substrate holder assembly and the anode. |
申请公布号 |
US2006196775(A1) |
申请公布日期 |
2006.09.07 |
申请号 |
US20050072137 |
申请日期 |
2005.03.04 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. |
发明人 |
SU HUNG-WEN;TSAI MING-HSING |
分类号 |
C25D3/00;C25D17/04 |
主分类号 |
C25D3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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