| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for bonding an anisotropic conductive film by using a laser in which necessary temperature rise time can be shortened in the case of connection using an ACF in an LCD or the like, the reliability and reproducibility of processes can be improved by accurate/automatic control of laser outputs, and process time can be shortened. <P>SOLUTION: The bonding apparatus comprises a laser light source 410 for generating a laser beam 402 of a prescribed wavelength by a control signal; a beam transmission optical system 420 for inducing the laser beam 402 to a connection to irradiate it; a substrate 404; a jig 430 for laminating an anisotropic conductive film 406 and a sample 408, irradiating the laminated sample side with the beam transmitted through the beam transmission optical system 420, and applying a control signal; an operation panel 440; and a controller 450 for setting the intensity, irradiation direction and voltage of the laser light source 410, and controlling the whole operation by an input from the operation panel 440. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
