发明名称 METHOD OF MANUFACTURING RIGID-FLEX BUILD-UP MULTILAYERED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To surely prevent the exuding of resin into a flexure at the time of building up a build-up resin layer on a rigid-flex substrate while minimizing an increase in the number of processes and putting as little restriction on design as possible. SOLUTION: A single-sided copper foil-attached resin sheet 30 is used as the build-up resin. At the time of forming an opening 33 by punching, a flange 34 for coating an end face 31A of the opening of the resin sheet 31 is formed from a copper foil 32 of the single-sided copper foil-attached resin sheet 30 at the edge of the opening 33 by hole flange processing. The flange 34 prevents the exuding of resin into the flexible portion. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006237172(A) 申请公布日期 2006.09.07
申请号 JP20050047945 申请日期 2005.02.23
申请人 FUJIKURA LTD 发明人 SUZUKI TOSHIYUKI;NAKAO SATORU
分类号 H05K3/46 主分类号 H05K3/46
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