| 摘要 |
PROBLEM TO BE SOLVED: To provide conductive paste for a via capable of providing long-term reliability without causing a defect such as a crack around a via conductor; and to provide a ceramic wiring board using it. SOLUTION: This conductive paste contains at least metal powder, glass powder and an organic constituent. In the conductive paste, the glass powder is formed of glass having a wetting angle of 90-180°at 900°C with respect to a metal plate of the same kind of the metal powder. The ceramic board is formed of a low temperature-baked ceramic material capable of being baked at a temperature below 1,000°C. In glass constituting the via conductor, the wetting angle at 900°C of its glass powder with respect to a metal plate formed of a constituent metal of the via conductor is 90-180°. The via conductor comprises a metal continuous phase and a glass dispersion phase. A minute and discontinuous space is present in at least either of a boundary between the via conductor and the low temperature-baked ceramic board and a boundary the metal phase and the glass phase in the via conductor. COPYRIGHT: (C)2006,JPO&NCIPI
|
