| 摘要 |
According to the present invention, one or more reinforcing vias ( 7 ) or reinforcing metal layers are disposed on the inner side of connecting electrodes ( 5 ). With this configuration, strength increases relative to a load applied for mounting a semiconductor element ( 3 ) and the sinking of the connecting electrodes ( 5 ) is reduced. Thus, it is possible to reduce the connecting stress of the semiconductor device, reduce the deformation of a joint, and increase flexibility in process design.
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