发明名称 Methods of making a curable composition having low coefficient of thermal expansion and an integrated circuit and a curable composition and integrated circuit made there from
摘要 Disclosed is a method for making a low CTE curable composition. In one embodiment, the method comprises mixing together (i) from 0.1 to 60.0% by weight of a nanoparticle composition and (ii) from 20.0 to 90.0% by weight of a curable binder to provide a premixture, based on the total weight of the premixture, and subjecting the premixture to high shear forces until the nanoparticle composition (i) is sufficiently dispersed in the curable binder (ii) to provide a curable composition. It has been found that the nanoparticle composition (i) must be at least one of (a) a strongly functionalized nanoparticle composition having no more than 25 mole % functionalization, (b) a weakly functionalized nanoparticle composition having from 1 to 100 mole % functionalization, (c) a nonfunctionalized nanoparticle composition, or (d) mixtures thereof.
申请公布号 US2006199301(A1) 申请公布日期 2006.09.07
申请号 US20050317661 申请日期 2005.12.23
申请人 BASHEER RAFIL A;WORKMAN DEREK B;CHAUDHURI ARUN K;BOUGUETTAYA MOHAMED 发明人 BASHEER RAFIL A.;WORKMAN DEREK B.;CHAUDHURI ARUN K.;BOUGUETTAYA MOHAMED
分类号 H01L21/00 主分类号 H01L21/00
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